Transfer Printing Technique for Thin Film Electronics

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2019-LEE-68568
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Thin film electronics offer performances beyond traditional bulk systems but on diverse substrates which can enable many emerging applications.

Researchers at Purdue University have developed a transfer printing methodology that allows for large-scale, defect-free, transfer of thin film electronics from an original wafer to an arbitrary substrate. This technology uses electrochemical reactions at the interface between the prefabrication thin film electronics and the original wafer. These reactions facilitate separation without the need of any mechanical peeling tools which could cause defects. Furthermore, the donor fabrication wafer can be reused multiple times which allows for major cost-savings in the manufacturing process.

Advantages:

-Defect free
-High performing
-Cost savings

Potential Applications:

-Thin-film electronics
-Biosensors
-Optoelectronics
May 29, 2019
Provisional-Patent
United States
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Purdue Office of Technology Commercialization
1801 Newman Road
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486
Email: otcip@prf.org