Simpler, Defect-free Assembly of 3D Metal-Dielectric Nanoarrays for Surface Plasmon Applications

Back to all technologies
Download as PDF
Researchers at Purdue University have developed a new nanoassembly methodology that occurs under wet condition, enabling defect-free integration of various quasi-3D plasmonic nanoarrays with a desired receiver substrate. Unlike many current approaches, the entire technology assembly occurs exclusively in distilled (DI) water at room temperature without the need of chemical or thermal treatments. Through a comprehensive set of data gained from experimental, computational, and theoretical studies, researchers have gained insight into the optimal conditions for controllable, repeatable, and defect-free outcomes.


Potential Applications:
-3D Metal-Dielectric Nanoarray
Dec 18, 2020
Utility-Gov. Funding
United States
Dec 6, 2022

Dec 2, 2022
CON-Gov. Funding
United States

Dec 18, 2019
United States
Purdue Office of Technology Commercialization
The Convergence Center
101 Foundry Drive, Suite 2500
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486