Simpler, Defect-free Assembly of 3D Metal-Dielectric Nanoarrays for Surface Plasmon Applications

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2019-LEE-68567
Researchers at Purdue University have developed a new nanoassembly methodology that occurs under wet condition, enabling defect-free integration of various quasi-3D plasmonic nanoarrays with a desired receiver substrate. Unlike many current approaches, the entire technology assembly occurs exclusively in distilled (DI) water at room temperature without the need of chemical or thermal treatments. Through a comprehensive set of data gained from experimental, computational, and theoretical studies, researchers have gained insight into the optimal conditions for controllable, repeatable, and defect-free outcomes.

Advantages:
-Defect-free
-Simpler
-Repeatability

Potential Applications:
-3D Metal-Dielectric Nanoarray
Dec 18, 2019
Provisional-Patent
United States
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Purdue Office of Technology Commercialization
1801 Newman Road
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486
Email: otcip@prf.org