| 2017-WU-67660 | |
| Flexible electronics have many advantages including providing weight savings, good portability, and ease of integration with other devices. There are many potential applications and the market for flexible electronics is forecast to grow nearly 10 times to $50 billion by 2020. Unfortunately, these devices are subject to repeated stress, which often leads to damage and cracks. There exists a need to enhance the reliability and durability of the metal components in flexible electronics. A Purdue University researcher has developed a process for fabricating CNT metal nanocomposites onto flexible substrates. This technology eliminates the need for costly masks or vacuums during the fabrication process and is suitable with a variety of metals including gold, silver, and copper. In addition, this technology enhances the durability and reliability of flexible electronics without degrading electrical properties. Advantages: -Cost effective -Provides high spatial resolution -Produces little thermal effect to the flexible substrate and other surrounding regions Potential Applications: -Sensors -Wearable electronics -Solar cells -Flexible displays |
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Oct 10, 2017
Utility Patent
United States
(None)
(None)
Oct 11, 2016
Provisional-Patent
United States
(None)
(None)
Oct 9, 2015
Provisional-Patent
United States
(None)
(None)
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Purdue Office of Technology Commercialization 1801 Newman Road West Lafayette, IN 47906 Phone: (765) 588-3475 Fax: (765) 463-3486 Email: otcip@prf.org |