|The manufacture of flexible electronics that exhibit the durability necessary for use on fabric substrates has always been a challenge. Wearable circuitry needs to exhibit an appropriate flexibility, durability, and adhesion to fabric substrates to be useful, yet present techniques rely on adhering electronics to fabric surfaces through resource-intensive processes that result in relatively delicate products with limited usefulness.
Researchers at Purdue University have developed a single-process manufacturing method, similar to 3D printing, which enables the rapid manufacture of wearable electronics at a fraction of the cost. This method prints flexible sensors into a fabric substrate resulting in embedded sensing devices with dramatic increases in sophistication and resilience. This discovery extends to the production of multi-material sensors in a single manufacturing step, sets the stage for the next generation of wearable electronics with greater sensitivity and durability, and leads to the possibility of many new, more capable applications.
-Inexpensive and smarter circuitry integrated into fabrics
-Manufacture of flexible, substrate embedded electronics
Jul 28, 2017
Jun 23, 2020
Jun 22, 2020
Jul 28, 2016
Purdue Office of Technology Commercialization
The Convergence Center
101 Foundry Drive, Suite 2500
West Lafayette, IN 47906
Phone: (765) 588-3475
Fax: (765) 463-3486