| 2015-SHIN-67218 | |
| Non-straight microholes with diameters varying with depth are needed for many important applications. However, it is still very challenging to drill non-straight microholes with arbitrarily varying diameters. Due to the very small-sized hole, it is very difficult to deliver laser beam energy directly to the microhole sidewall to change the diameter of the hole in a controlled way. Past work has been reported on drilling reverse tapered microholes through electrical discharge machining (EDM) and micro electrochemical machining (ECM); however, such techniques are limited to conductive materials. Researchers at Purdue University have developed a novel manufacturing technique for creating non-straight microholes called laser ablation and plasma amplification (LAPA). Its essential physical process is the interaction among a picosecond laser pulse, plasma generated by a prior nano- or picosecond laser pulse, and a microhole sidewall. LAPA promises a solution for fast, cost-effective, high-quality manufacturing of non-straight microholes with arbitrarily varying diameters. This will have a broad impact on many related areas such as fuel efficiency improvement and the reduction of toxic gas emission to the environment. Advantages: -Perform machining operations that were previously impossible -Faster than existing methods -Create precise holes in non-conductive materials Potential Applications: -Diesel engine fuel injector fabrication -Aerospace engines -Precision manufacturing |
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Jul 28, 2016
Utility Patent
United States
10,052,722
Aug 21, 2018
Aug 19, 2018
DIV-Patent
United States
(None)
(None)
Jul 30, 2015
Provisional-Patent
United States
(None)
(None)
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Purdue Office of Technology Commercialization 1801 Newman Road West Lafayette, IN 47906 Phone: (765) 588-3475 Fax: (765) 463-3486 Email: otcip@prf.org |