| 2015-SHIN-67048 | |
| Many advanced materials, such as ceramics, composites, and high temperature alloys, are difficult to machine. Some solutions to address this issue employ a laser-assisted method; however, currently used laser-assisted micromachining techniques do not provide flexible beam positioning methods with a requisite low incidence angle. Therefore, these methods are limited to machining only simple features. Also, laser machining, ultrasonic machining, precision grinding, and other micro milling solutions in use yield very limited material removal rates. Researchers at Purdue University have developed a new technology for laser-assisted micro milling of difficult to machine materials. This system is capable of micro milling these materials with higher material removal rates than existing systems by using a novel, flexible beam delivery mechanism. The laser's positioning thermally softens the material, resulting in lower cutting forces, longer tool life, and improved machined surface quality. This system allows for more advanced machining options including pocketing, contouring, deep slot milling. Advantages: -Extends the life of the machining tool -Increases precision in machining process -Increases material removal rates -Advanced machining options Potential Applications: -Parts manufacturers -Materials industry -Micromachining Systems |
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May 2, 2017
Utility Patent
United States
10,549,382
Feb 4, 2020
May 4, 2016
Provisional-Patent
United States
(None)
(None)
May 1, 2015
Provisional-Patent
United States
(None)
(None)
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Purdue Office of Technology Commercialization The Convergence Center 101 Foundry Drive, Suite 2500 West Lafayette, IN 47906 Phone: (765) 588-3475 Fax: (765) 463-3486 Email: otcip@prf.org |