Nontoxic Solvent for Metal Dissolution in Electronics Manufacturing

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2015-AGRA-66929
Dissolving elemental metals, metal salts, organometallic complexes, metal chalcogenides, and metal oxides in solvent has been a long-standing obstacle in the production of thin film, nanoparticle, and inks containing these compounds for use in manufacturing.

Researchers at Purdue University have developed a method based on a versatile solvent mixture that can dissolve all of these materials, allowing for the production of fabrication materials that are extremely advantageous in the manufacturing of semiconductor devices, especially photovoltaic cells. By creating these fabrication materials in thin film, nanoparticle, and ink forms, more efficient manufacturing techniques, like roll-to-roll manufacturing, can be utilized. Beyond their use in the manufacturing of semiconductors, the solvents can be used to infiltrate metal containing compounds into porous structures.

Advantages:
-Low capital cost in raw materials and equipment
-High throughput production
-Better compatibility
-Used with porous structures

Potential Applications:
-Materials manufacturers
-Semiconductor manufacturers
Jul 26, 2016
CON-Patent
United States
9,862,844
Jan 9, 2018

Aug 12, 2015
Utility Patent
United States
9,738,799
Aug 22, 2017

Aug 12, 2014
Provisional-Patent
United States
(None)
(None)
Purdue Office of Technology Commercialization
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