Sew and Transfer Method for Fabricating Highly Stretchable, Robust Electrical Interconnects

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2014-ZIAI-66752
Fabricating highly stretchable, robust electrical interconnects at low-cost remains an unmet challenge in stretchable electronics. Previously reported, stretchable interconnects require complicated fabrication processes with resulting devices exhibiting limited stretchability, poor reliability, and large gauge factors.

Purdue University researchers have developed a novel, sew and transfer method for rapid fabrication of low-cost, highly stretchable interconnects. Using a commercial sewing machine and double-thread stitch, with one of the threads being water-soluble polyvinyl alcohol (PVA), thin zigzag pattern metallic wires are sewn into a polymeric film and are subsequently transferred onto a stretchable elastomeric substrate by dissolving PVA in warm water. The resulting structures exhibit extreme stretchability and robustness.

Advantages:
-Low-cost method to fabricate stretchable electronics
-Extreme stretchability and robustness
-No change in resistance with strain

Potential Applications:
-Wearable electronics
-Skin mounted electronics
-Implantable medical systems
Jul 29, 2016
Utility Patent
United States
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May 31, 2015
Provisional-Patent
United States
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May 29, 2014
Provisional-Patent
United States
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