Kiss Bond Detection

Back to all technologies
Download as PDF
65800
Several types of future aircraft and other types of systems such as composite ships will be constructed using adhesive joining techniques that can be susceptible to kiss bond phenomena, or insufficent contact between materials adhered together. In order to satisfy the fail-safe or damage tolerant allowables for the structural integrity of such aircraft, it must be guaranteed through inspection that no kiss bonds are present in these adhesive joints.

Researchers at Purdue University have developed a technology that can reliably detect kiss bonds. This technology is much easier to apply for an untrained inspector and is also less expensive from an instrumentation standpoint when compared to current ultrasonic sensing techniques. Additionally, Purdue University researchers have developed an inspection technique to quantify the effectiveness of in situ repairs to aircraft.

Advantages:
-Easier for untrained inspectors to use
-Less expensive than ultrasonic sensing

Potential Applications:
-Materials
-Manufacturing
Nov 5, 2013
NATL-Patent
United States
9,488,620
Nov 8, 2016

Mar 15, 2012
PCT-Patent
WO
(None)
(None)

Mar 15, 2011
Provisional-Patent
United States
(None)
(None)
Purdue Office of Technology Commercialization
1801 Newman Road
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486
Email: otcip@prf.org