Thermal and/or Electrical Contact Conduction Enhancer

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In the electronics industry, a common issue is the transfer of heat away from heat producing components and the surrounding components. Continuous contact between the components is not physically possible resulting in an air gap, which is a very poor conductor. Current methods to compensate for these gaps include thermal greases and phase change materials (PCMs), which have efficiency limitations.

Researchers at Purdue University have developed a product that provides greater conduction at the interface of two surfaces than other removable products. The technology affords this advantage by creating increased contact area at the interface through billions of surface contact sites, and in effect, reduces the thermal and electrical resistance between the two surfaces. This product is versatile enough to be used alone or with existing commercial greases and wax-based PCMs.

Advantages:
-Provides lower thermal and electrical resistance than any other removable interface material
-Easily conforms to a variety of surfaces
-Increased area of contact between surfaces
-Provides application to many processes in electronics industry

Potential Applications:
-Electronics Industry
Oct 17, 2007
NATL-Patent
Canada
2,666,815
May 28, 2013

Oct 17, 2007
Utility Patent
United States
8,220,530
Jul 17, 2012

May 8, 2012
DIV-Patent
United States
(None)
(None)

Oct 17, 2007
PCT-Patent
WO
(None)
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Oct 17, 2007
NATL-Patent
European Patent
(None)
(None)

Oct 17, 2007
DIV-Patent
Canada
(None)
(None)

Oct 17, 2006
Provisional-Patent
United States
(None)
(None)
Purdue Office of Technology Commercialization
1801 Newman Road
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486
Email: otcip@prf.org