Laser Assisted Micro Machining

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Traditionally, methods used to make micro- and mesoscale parts from hard materials, such as ceramics, are slow and costly. These methods require micro EDM, ultrasonic machining, or short-pulse laser machining, which all include the potential for a recast layer or subsurface damage.

Researchers at Purdue University have developed a method for laser-assisted micromachining that prevents any subsurface damage. This process works on both conductive and non-conductive materials. This technology allows for cutting very hard materials at relatively high speeds with attainable feature sizes from 25 microns to 1000 microns (1mm).

-No subsurface damage in production of micro- and mesoscale parts
-Works on conductive and non-conductive hard materials
-Allows machining of materials at higher speeds relative to most existing methods
-Feature sizes from 25 microns to 1000 microns (1mm) are attainable

Potential Applications:
May 7, 2008
Utility Patent
United States
Sep 30, 2014

May 7, 2007
United States

May 4, 2006
United States
Purdue Office of Technology Commercialization
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