| 64403 | |
| Traditionally, methods used to make micro- and mesoscale parts from hard materials, such as ceramics, are slow and costly. These methods require micro EDM, ultrasonic machining, or short-pulse laser machining, which all include the potential for a recast layer or subsurface damage. Researchers at Purdue University have developed a method for laser-assisted micromachining that prevents any subsurface damage. This process works on both conductive and non-conductive materials. This technology allows for cutting very hard materials at relatively high speeds with attainable feature sizes from 25 microns to 1000 microns (1mm). Advantages: -No subsurface damage in production of micro- and mesoscale parts -Works on conductive and non-conductive hard materials -Allows machining of materials at higher speeds relative to most existing methods -Feature sizes from 25 microns to 1000 microns (1mm) are attainable Potential Applications: -Materials -Manufacturing |
|
|
|
|
May 7, 2008
Utility Patent
United States
8,847,114
Sep 30, 2014
May 7, 2007
Provisional-Patent
United States
(None)
(None)
May 4, 2006
Provisional-Patent
United States
(None)
(None)
|
|
|
Purdue Office of Technology Commercialization 1801 Newman Road West Lafayette, IN 47906 Phone: (765) 588-3475 Fax: (765) 463-3486 Email: otcip@prf.org |