Laser Assisted Micro Machining

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Traditionally, methods used to make micro- and mesoscale parts from hard materials, such as ceramics, are slow and costly. These methods require micro EDM, ultrasonic machining, or short-pulse laser machining, which all include the potential for a recast layer or subsurface damage.

Researchers at Purdue University have developed a method for laser-assisted micromachining that prevents any subsurface damage. This process works on both conductive and non-conductive materials. This technology allows for cutting very hard materials at relatively high speeds with attainable feature sizes from 25 microns to 1000 microns (1mm).

Advantages:
-No subsurface damage in production of micro- and mesoscale parts
-Works on conductive and non-conductive hard materials
-Allows machining of materials at higher speeds relative to most existing methods
-Feature sizes from 25 microns to 1000 microns (1mm) are attainable

Potential Applications:
-Materials
-Manufacturing
May 7, 2008
Utility Patent
United States
8,847,114
Sep 30, 2014

May 7, 2007
Provisional-Patent
United States
(None)
(None)

May 4, 2006
Provisional-Patent
United States
(None)
(None)
Purdue Office of Technology Commercialization
1801 Newman Road
West Lafayette, IN 47906

Phone: (765) 588-3475
Fax: (765) 463-3486
Email: otcip@prf.org