| 64091 | |
| Thermal interface materials experience the pump out effect and the dry out effect, which increases thermal resistance and degrades the effective interface material performance. Improvements in thermal interface materials is needed. Purdue University researchers have developed a technology that uses carbon nanotube arrays to prevent the pump out effect and may prevent the dry out effect. Using carbon nanotubes improves effective thermal contact conductance of the interface when compared to a continuous layer of the thermal interface alone. Advantages: -Reduces thermal resistance -Improved thermal contact conductance Potential Applications: -Power integrated circuits -Single-chip devices |
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Aug 4, 2006
Utility Patent
United States
8,093,715
Jan 10, 2012
Aug 5, 2006
PCT-Patent
WO
(None)
(None)
Aug 5, 2005
Provisional-Patent
United States
(None)
(None)
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Purdue Office of Technology Commercialization 1801 Newman Road West Lafayette, IN 47906 Phone: (765) 588-3475 Fax: (765) 463-3486 Email: otcip@prf.org |