Enhancement of Soft Thermal Interface Materials with Carbon Nanotube Arrays

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Thermal interface materials experience the pump out effect and the dry out effect, which increases thermal resistance and degrades the effective interface material performance. Improvements in thermal interface materials is needed.

Purdue University researchers have developed a technology that uses carbon nanotube arrays to prevent the pump out effect and may prevent the dry out effect. Using carbon nanotubes improves effective thermal contact conductance of the interface when compared to a continuous layer of the thermal interface alone.

-Reduces thermal resistance
-Improved thermal contact conductance

Potential Applications:
-Power integrated circuits
-Single-chip devices
Aug 4, 2006
Utility Patent
United States
Jan 10, 2012

Aug 5, 2006

Aug 5, 2005
United States
Purdue Office of Technology Commercialization
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